Patent Assignment Details
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| Reel/Frame: | 013324/0452 | |
| Pages: | 3 |
| | Recorded: | 09/23/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10251762
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Filing Dt:
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09/23/2002
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Publication #:
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Pub Dt:
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10/30/2003
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Title:
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PACKAGE STACKED SEMICONDUCTOR DEVICE HAVING PIN LINKING MEANS
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Assignee
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| NO. 634-1, TONGSAM-RI, NAMSA-MYUN |
| YONGYIN-SI |
| KYUNGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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POWELL, GOLDSTEIN, FRAZER ET AL.
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SUN HEE LEE
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P.O. BOX 987223
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WASHINGTON, DC 20090-7223
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