Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 023303/0453 | |
| Pages: | 3 |
| | Recorded: | 09/17/2009 | | |
Attorney Dkt #: | 2557-001330/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
12585537
|
Filing Dt:
|
09/17/2009
|
Publication #:
|
|
Pub Dt:
|
03/18/2010
| | | | |
Title:
|
WAFER TEMPORARY BONDING METHOD USING SILICON DIRECT BONDING
|
|
Assignee
|
|
|
416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
|
Correspondence name and address
|
|
HARNESS, DICKEY & PIERCE, P.L.C.
|
|
P.O. BOX 8910
|
|
RESTON, VA 20195
|
Search Results as of:
10/31/2024 07:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|