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Reel/Frame:023303/0453   Pages: 3
Recorded: 09/17/2009
Attorney Dkt #:2557-001330/US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/01/2013
Application #:
12585537
Filing Dt:
09/17/2009
Publication #:
Pub Dt:
03/18/2010
Title:
WAFER TEMPORARY BONDING METHOD USING SILICON DIRECT BONDING
Assignors
1
Exec Dt:
09/01/2009
2
Exec Dt:
09/08/2009
3
Exec Dt:
09/08/2009
4
Exec Dt:
09/08/2009
5
Exec Dt:
09/08/2009
Assignee
1
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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