Patent Assignment Details
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| Reel/Frame: | 027600/0454 | |
| Pages: | 4 |
| | Recorded: | 01/26/2012 | | |
| Attorney Dkt #: | 085027-0801 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13358496
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Filing Dt:
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01/25/2012
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Publication #:
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Pub Dt:
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08/02/2012
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Title:
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MULTICHIP PACKAGES INCLUDING THROUGH SUBSTRATE VIAS FORMED BY ENCLOSURE FIRST TECHNOLOGY
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Assignee
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| 8F.-1, NO. 29, PUDING ROAD |
| EAST DISTRICT |
| HSINCHU, TAIWAN 30072 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005
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05/31/2024 04:56 PM
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