Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064800/0455 | |
| Pages: | 6 |
| | Recorded: | 09/05/2023 | | |
| Attorney Dkt #: | 088453.8381.US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18461373
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Filing Dt:
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09/05/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Title:
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SEMICONDUCTOR DEVICE INCLUDING A THROUGH SILICON VIA STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignee
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| 2091, GYEONGCHUNG-DAERO |
| BUBAL-EUB, GYEONGGI-DO |
| ICHEON-SI, KOREA, REPUBLIC OF 17336 |
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Correspondence name and address
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BING AI
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P.O. BOX 1247
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SEATTLE, WA 98111-1247
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05/23/2024 05:19 AM
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