Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017951/0456 | |
| Pages: | 5 |
| | Recorded: | 06/01/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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11157186
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Filing Dt:
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06/17/2005
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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METALLIZATION STRUCTURE OVER PASSIVATION LAYER FOR IC CHIP
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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11178753
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Filing Dt:
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07/11/2005
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Publication #:
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Pub Dt:
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03/23/2006
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Title:
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CHIP STRUCTURE
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Patent #:
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Issue Dt:
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01/15/2008
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Application #:
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11181244
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Filing Dt:
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07/14/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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CHIP STRUCTURE WITH REDISTRIBUTION TRACES
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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11183648
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Filing Dt:
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07/18/2005
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Publication #:
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Pub Dt:
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01/19/2006
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Title:
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CONNECTION BETWEEN A SEMICONDUCTOR CHIP AND A CIRCUIT COMPONENT WITH A LARGE CONTACT AREA
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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11183658
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Filing Dt:
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07/18/2005
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Publication #:
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Pub Dt:
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11/10/2005
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Title:
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OVER-PASSIVATION PROCESS OF FORMING POLYMER LAYER OVER IC CHIP
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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11202730
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Filing Dt:
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08/12/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Title:
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METHOD FOR FABRICATING CHIP STRUCTURE
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Patent #:
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Issue Dt:
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06/16/2009
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Application #:
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11262182
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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SEMICONDUCTOR CHIP WITH PASSIVATION LAYER COMPRISING METAL INTERCONNECT AND CONTACT PADS
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Patent #:
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Issue Dt:
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07/08/2008
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Application #:
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11262184
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVATION LAYER
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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JONN CHEN
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ROOM 303, 3F., NO 25, SEC. 1, CHANGAN E.
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ROAD
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TAIPEI, TAIWAN R.O.C. 10441
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