Patent Assignment Details
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| Reel/Frame: | 018479/0457 | |
| Pages: | 3 |
| | Recorded: | 11/03/2006 | | |
| Attorney Dkt #: | 2003 P 54541 US (LW) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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11485194
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Filing Dt:
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07/12/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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METHOD FOR CONNECTING A DIE ASSEMBLY TO A SUBSTRATE IN AN INTEGRATED CIRCUIT AND A SEMICONDUCTOR DEVICE COMPRISING A DIE ASSEMBLY
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Assignee
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| ST.-MARTIN-STRASSE 53 |
| MUENCHEN, GERMANY 81669 |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON RD.
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SUITE 1000
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DALLAS, TX 75252
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