Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056872/0457 | |
| Pages: | 4 |
| | Recorded: | 07/15/2021 | | |
| Attorney Dkt #: | 102351-1826-01727/US11222 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17377169
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Filing Dt:
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07/15/2021
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING REINFORCEMENT
COMPONENT AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 26 CHIN 3RD ROAD, NANZIH |
| KAOHSIUNG, TAIWAN 811 |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K STREET, N.W.
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SUITE 600
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WASHINGTON, DC 20007
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