Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044763/0459 | |
| Pages: | 2 |
| | Recorded: | 01/30/2018 | | |
| Attorney Dkt #: | FLEX-00000 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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11828196
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Filing Dt:
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07/25/2007
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Publication #:
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Pub Dt:
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08/28/2008
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Title:
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EMBEDDING AN ELECTRONIC COMPONENT BETWEEN SURFACES OF A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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05/30/2017
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Application #:
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13897253
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Filing Dt:
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05/17/2013
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Title:
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INLAY PCB WITH EMBEDDED COIN BOARD
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Patent #:
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Issue Dt:
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12/13/2016
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Application #:
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14463361
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Filing Dt:
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08/19/2014
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Title:
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EMBEDDED COMPONENTS IN A SUBSTRATE
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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14476549
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Filing Dt:
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09/03/2014
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Title:
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EMBEDDED COINS FOR HDI OR SEQ LAMINATIONS
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Patent #:
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Issue Dt:
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06/12/2018
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Application #:
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15081623
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Filing Dt:
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03/25/2016
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Publication #:
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Pub Dt:
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09/14/2017
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Title:
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SELF-DECAP CAVITY FABRICATION PROCESS AND STRUCTURE
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Assignee
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| 2 CHANGI SOUTH LANE |
| SINGAPORE, SINGAPORE 486123 |
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Correspondence name and address
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JACK R. HARRIS
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162 NORTH WOLFE ROAD
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SUNNYVALE, CA 94086
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