Patent Assignment Details
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Reel/Frame: | 051104/0459 | |
| Pages: | 5 |
| | Recorded: | 11/25/2019 | | |
Attorney Dkt #: | 013057.1899C1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16693960
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Filing Dt:
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11/25/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Title:
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MAGNETIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, BONDING STRUCTURE BETWEEN MAGNETIC SUBSTRATE AND INSULATING MATERIAL, AND CHIP COMPONENT HAVING THE BONDING STRUCTURE
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Assignee
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MAEYOUNG-RO 150 (MAETAN-DONG), YEONGTONG-GU, GYEONGGI-DO |
SUWON-SI, KOREA, REPUBLIC OF |
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Correspondence name and address
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NSIP LAW
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P.O. BOX 65745
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WASHINGTON, DC 20035
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