Patent Assignment Details
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| Reel/Frame: | 012016/0460 | |
| Pages: | 3 |
| | Recorded: | 07/23/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09910053
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Filing Dt:
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07/23/2001
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Publication #:
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Pub Dt:
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01/23/2003
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Title:
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Structure of a chip package
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Assignee
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| 8F-5, NO. 6, LANE 609, CHUNG HSING RD., SEC. 5 |
| SANCHUNG CITY, TAIWAN |
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Correspondence name and address
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CHIH-YU TING
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PO BOX 82-144
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TAIPEI, TAIWAN
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