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Patent Assignment Details
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Reel/Frame:030766/0460   Pages: 4
Recorded: 07/10/2013
Attorney Dkt #:1698.10479G00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
08/13/2002
Application #:
09092138
Filing Dt:
06/05/1998
Title:
SEMICONDUCTOR DEVICE HAVING A POROUS BUFFER LAYER FOR SEMICONDUCTOR DEVICE
2
Patent #:
Issue Dt:
05/08/2007
Application #:
10788392
Filing Dt:
03/01/2004
Publication #:
Pub Dt:
09/09/2004
Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
3
Patent #:
Issue Dt:
04/08/2008
Application #:
10797003
Filing Dt:
03/11/2004
Publication #:
Pub Dt:
09/16/2004
Title:
MOLD DIE FOR A SEMICONDUCTOR DEVICE
4
Patent #:
Issue Dt:
05/02/2006
Application #:
10830051
Filing Dt:
04/23/2004
Publication #:
Pub Dt:
10/07/2004
Title:
WIRING TAPE FOR SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER HAVING INTERCONNECTED FOAMS
Assignor
1
Exec Dt:
06/28/2013
Assignee
1
1-10-5, YOKOAMI, SUMIDA-KU
TOKYO, JAPAN 130-0015
Correspondence name and address
ANTONELLI, TERRY, STOUT & KAUS, LLP
1300 N. 17TH STREET
SUITE 1800
ARLINGTON, VA 22209

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