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Patent Assignment Details
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Reel/Frame:031541/0461   Pages: 83
Recorded: 10/24/2013
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/28/2006
Application #:
09874666
Filing Dt:
06/05/2001
Publication #:
Pub Dt:
02/14/2002
Title:
CONTROLLED COLLAPSE CHIP CONNECTION (C4) INTEGRATED CIRCUIT PACKAGE WHICH HAS TWO DISSIMILAR UNDERFILL MATERIALS
Assignor
1
Exec Dt:
11/22/2011
Assignee
1
8000 SO. FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondence name and address
MARK V. MULLER
SCHWEGMAN, LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402-0938

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