Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 039186/0461 | |
| Pages: | 2 |
| | Recorded: | 06/28/2016 | | |
| Attorney Dkt #: | 70027-1678 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13042457
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Filing Dt:
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03/07/2011
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Publication #:
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Pub Dt:
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09/13/2012
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4677 OLD IRONSIDES DRIVE
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SUITE 370
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SANTA CLARA, CA 95054
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