Patent Assignment Details
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| Reel/Frame: | 012963/0464 | |
| Pages: | 6 |
| | Recorded: | 06/05/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/16/2003
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Application #:
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10163671
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Filing Dt:
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06/05/2002
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Title:
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ENGAGEMENT MECHANISM FOR SEMICONDUCTOR SUBSTRATE DEPOSITION PROCESS KIT HARDWARE
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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WELLS ST. JOHN P.S.
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MARK S. MATKIN
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601 WEST FIRST AVENUE, SUITE 1300
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SPOKANE, WA 99201-3828
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