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Patent Assignment Details
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Reel/Frame:013540/0465   Pages: 6
Recorded: 11/27/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10306565
Filing Dt:
11/27/2002
Publication #:
Pub Dt:
05/27/2004
Title:
Process for fabricating a semiconductor device having an insulating layer formed over a semiconductor substrate
Assignors
1
Exec Dt:
11/26/2002
2
Exec Dt:
11/26/2002
3
Exec Dt:
11/26/2002
4
Exec Dt:
11/26/2002
Assignee
1
555 UNION BOULEVARD
ALLENTOWN, PENNSYLVANIA 18109
Correspondence name and address
HITT GAINES & BOISBRUN, P.C.
CHARLES W. GAINES
P.O. BOX 832570
RICHARDSON, TX 75083

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