Patent Assignment Details
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| Reel/Frame: | 058658/0465 | |
| Pages: | 3 |
| | Recorded: | 01/14/2022 | | |
| Attorney Dkt #: | 396201.0020 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17575999
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Filing Dt:
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01/14/2022
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Publication #:
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Pub Dt:
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07/14/2022
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Title:
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MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFER AND SYSTEM FOR MANUFACTURING WAFER
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Assignee
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| 17-15, 4SANDAN 7-RO, JIKSAN-EUP, SEOBUK-GU, CHUNGCHEONGNAM-DO |
| CHEONAN-SI, KOREA, REPUBLIC OF 31040 |
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Correspondence name and address
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NSIP LAW
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1120 CONNECTICUT AVE, NW, SUITE 304
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WASHINGTON, DC 20036
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05/29/2024 11:37 PM
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