Total properties:
50
|
|
Patent #:
|
|
Issue Dt:
|
10/31/2000
|
Application #:
|
09459019
|
Filing Dt:
|
12/10/1999
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING DRY PHOTORESIST FILM
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09487165
|
Filing Dt:
|
01/19/2000
|
Title:
|
Method for packaging semiconductor device having bump electrodes
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2003
|
Application #:
|
09494916
|
Filing Dt:
|
01/31/2000
|
Publication #:
|
|
Pub Dt:
|
01/03/2002
| | | | |
Title:
|
A MOUNTING STRUCTURE HAVING COLUMNAR ELECTRODES AND A SEALING FILM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09499599
|
Filing Dt:
|
02/07/2000
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2002
|
Application #:
|
09630677
|
Filing Dt:
|
08/01/2000
|
Title:
|
SEMICONDUCTOR DEVICE HAVING SEALING FILM FORMED ON THE SURFACE HAVING COLUMNAR ELECTRODE FORMED THEREON AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2003
|
Application #:
|
09704156
|
Filing Dt:
|
11/01/2000
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09708379
|
Filing Dt:
|
11/08/2000
|
Title:
|
SEMICONDUCTOR DEVICE WHICH PREVENTS LEAKAGE OF NOISE GENERATED IN A CIRCUIT ELEMENT FORMING AREA AND WHICH SHIELDS AGAINST EXTERNAL ELLECTROMAGNETIC NOISE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09722943
|
Filing Dt:
|
11/27/2000
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING SEALING FILM ON ITS SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/2003
|
Application #:
|
09736797
|
Filing Dt:
|
12/14/2000
|
Publication #:
|
|
Pub Dt:
|
06/28/2001
| | | | |
Title:
|
RESIN FILM FORMING METHOD AND RESIN FILM FORMING APPARATUS EMPLOYING SAID METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09858230
|
Filing Dt:
|
05/15/2001
|
Publication #:
|
|
Pub Dt:
|
11/22/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10472803
|
Filing Dt:
|
09/23/2003
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2005
|
Application #:
|
10663043
|
Filing Dt:
|
09/15/2003
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2007
|
Application #:
|
10700136
|
Filing Dt:
|
11/03/2003
|
Publication #:
|
|
Pub Dt:
|
05/20/2004
| | | | |
Title:
|
WIRING STRUCTURE ON SEMICONDUCTOR SUBSTRATE AND METHOD OF FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2006
|
Application #:
|
10851880
|
Filing Dt:
|
05/20/2004
|
Publication #:
|
|
Pub Dt:
|
01/27/2005
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CONSTRUCTING BODY AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2006
|
Application #:
|
10874913
|
Filing Dt:
|
06/22/2004
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING BUILT-IN MICRO ELECTRIC MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2006
|
Application #:
|
11037423
|
Filing Dt:
|
01/18/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE UTILIZING A THERMOSETTING RESIN BASE MEMBER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2008
|
Application #:
|
11040593
|
Filing Dt:
|
01/21/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING CONDUCTING PORTION OF UPPER AND LOWER CONDUCTIVE LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
11041040
|
Filing Dt:
|
01/21/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2007
|
Application #:
|
11043355
|
Filing Dt:
|
01/26/2005
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2008
|
Application #:
|
11043886
|
Filing Dt:
|
01/26/2005
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
Title:
|
OPTICAL SENSOR MODULE WITH SEMICONDUCTOR DEVICE FOR DRIVE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2009
|
Application #:
|
11359851
|
Filing Dt:
|
02/22/2006
|
Publication #:
|
|
Pub Dt:
|
06/29/2006
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CONSTRUCTING BODY AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/2010
|
Application #:
|
11443858
|
Filing Dt:
|
05/31/2006
|
Publication #:
|
|
Pub Dt:
|
12/07/2006
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING REDUCED NUMBER OF EXTERNAL PAD PORTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2009
|
Application #:
|
11457360
|
Filing Dt:
|
07/13/2006
|
Publication #:
|
|
Pub Dt:
|
11/02/2006
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING A BASE MEMBER AND A SEMICONDUCTOR CONSTRUCTING BODY DIRECTLY FIXED TO THERMOSETTING RESIN OF THE BASE MEMBER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/21/2009
|
Application #:
|
11520554
|
Filing Dt:
|
09/13/2006
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING SHIELD STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
11524481
|
Filing Dt:
|
09/20/2006
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE COMPRISING A PLURALITY OF SEMICONDUCTOR CONSTRUCTS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2009
|
Application #:
|
11588647
|
Filing Dt:
|
10/27/2006
|
Publication #:
|
|
Pub Dt:
|
02/22/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
11638717
|
Filing Dt:
|
12/14/2006
|
Publication #:
|
|
Pub Dt:
|
11/22/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC INSULATING FILM AND MANUFACTURING METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2007
|
Application #:
|
11639747
|
Filing Dt:
|
12/15/2006
|
Publication #:
|
|
Pub Dt:
|
06/21/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2009
|
Application #:
|
11645044
|
Filing Dt:
|
12/22/2006
|
Publication #:
|
|
Pub Dt:
|
06/28/2007
| | | | |
Title:
|
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2011
|
Application #:
|
11656866
|
Filing Dt:
|
01/22/2007
|
Publication #:
|
|
Pub Dt:
|
07/19/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING ALIGNMENT POST ELECTRODE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/17/2009
|
Application #:
|
11671268
|
Filing Dt:
|
02/05/2007
|
Publication #:
|
|
Pub Dt:
|
06/07/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2009
|
Application #:
|
11671318
|
Filing Dt:
|
02/05/2007
|
Publication #:
|
|
Pub Dt:
|
06/07/2007
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2010
|
Application #:
|
11706772
|
Filing Dt:
|
02/15/2007
|
Publication #:
|
|
Pub Dt:
|
08/16/2007
| | | | |
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2010
|
Application #:
|
11788397
|
Filing Dt:
|
04/19/2007
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/11/2008
|
Application #:
|
11804160
|
Filing Dt:
|
05/17/2007
|
Publication #:
|
|
Pub Dt:
|
11/22/2007
| | | | |
Title:
|
CHIP-TYPE ELECTRONIC COMPONENT INCLUDING THIN-FILM CIRCUIT ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2010
|
Application #:
|
11853673
|
Filing Dt:
|
09/11/2007
|
Publication #:
|
|
Pub Dt:
|
01/10/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY AN INSULATING MEMBER AND WIRING STRUCTURES ON UPPER AND LOWER SURFACES OF THE SEMICONDUCTOR ELEMENT AND INSULATING MEMBER, AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/21/2009
|
Application #:
|
11853683
|
Filing Dt:
|
09/11/2007
|
Publication #:
|
|
Pub Dt:
|
02/21/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY AN INSULATING MEMBER AND WIRING STRUCTURES ON UPPER AND LOWER SURFACES OF THE SEMICONDUCTOR ELEMENT AND INSULATING MEMBER, AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2009
|
Application #:
|
11860970
|
Filing Dt:
|
09/25/2007
|
Publication #:
|
|
Pub Dt:
|
01/24/2008
| | | | |
Title:
|
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING CONDUCTING PORTION OF UPPER AND LOWER CONDUCTIVE LAYERS ON A PERIPHERAL SURFACE OF THE SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2012
|
Application #:
|
12042427
|
Filing Dt:
|
03/05/2008
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR STRUCTURE BODIES ON UPPER AND LOWER SURFACES THEREOF, AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2012
|
Application #:
|
12069689
|
Filing Dt:
|
02/12/2008
|
Publication #:
|
|
Pub Dt:
|
08/14/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH MAGNETIC POWDER MIXED THEREIN AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2011
|
Application #:
|
12079259
|
Filing Dt:
|
03/26/2008
|
Publication #:
|
|
Pub Dt:
|
10/02/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE COMPRISING CIRCUIT SUBSTRATE WITH INSPECTION CONNECTION PADS AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2010
|
Application #:
|
12194846
|
Filing Dt:
|
08/20/2008
|
Publication #:
|
|
Pub Dt:
|
02/26/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTITUENT AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
12218685
|
Filing Dt:
|
07/17/2008
|
Publication #:
|
|
Pub Dt:
|
11/20/2008
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PACKAGED INTO CHIP SIZE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2010
|
Application #:
|
12415782
|
Filing Dt:
|
03/31/2009
|
Publication #:
|
|
Pub Dt:
|
08/13/2009
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2011
|
Application #:
|
12506503
|
Filing Dt:
|
07/21/2009
|
Publication #:
|
|
Pub Dt:
|
01/28/2010
| | | | |
Title:
|
METHOD OF FORMING WIRING ON A PLURALITY OF SEMICONDUCTOR DEVICES FROM A SINGLE METAL PLATE, AND A SEMICONDUCTOR CONSTRUCTION ASSEMBLY FORMED BY THE METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2011
|
Application #:
|
12729608
|
Filing Dt:
|
03/23/2010
|
Publication #:
|
|
Pub Dt:
|
08/05/2010
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTITUENT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2012
|
Application #:
|
13069771
|
Filing Dt:
|
03/23/2011
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
Title:
|
SEMICONDUCTOR DEVICE PROVIDED WITH TIN DIFFUSION INHIBITING LAYER, AND MANUFACTURING METHOD OF THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
|
Application #:
|
13074233
|
Filing Dt:
|
03/29/2011
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2012
|
Application #:
|
13074279
|
Filing Dt:
|
03/29/2011
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2013
|
Application #:
|
13225693
|
Filing Dt:
|
09/06/2011
|
Publication #:
|
|
Pub Dt:
|
03/29/2012
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
|
|