Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028033/0476 | |
| Pages: | 3 |
| | Recorded: | 04/12/2012 | | |
| Attorney Dkt #: | 48047.66/2010-026USHM |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11669664
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Filing Dt:
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01/31/2007
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Publication #:
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Pub Dt:
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03/27/2008
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Title:
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FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRANE
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Assignee
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| 9, LI-HSIN 4TH ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE LLP
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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