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Reel/Frame:052298/0476   Pages: 6
Recorded: 04/02/2020
Attorney Dkt #:SCH-20010-USPT
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/25/2022
Application #:
16836241
Filing Dt:
03/31/2020
Publication #:
Pub Dt:
10/15/2020
Title:
FIRMWARE BOOT IMPLEMENTATION METHOD BASED ON FLASH CHIP SIMULATION CONNECTED TO A MASTER MICROCONTROLLER UNIT (MCU) AND SLAVE MCU
Assignors
1
Exec Dt:
03/25/2020
2
Exec Dt:
03/25/2020
3
Exec Dt:
03/25/2020
4
Exec Dt:
03/25/2020
Assignee
1
NO. 1 LINGXIA NORTH ROAD, HIGH TECH PARK, HULI DISTRICT
XIAMEN, FUJIAN, CHINA 361009
Correspondence name and address
BYIP LTD.
5700 GRANITE PARKWAY, SUITE 200
PLANO, TX 75024

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