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Reel/Frame:020675/0480   Pages: 4
Recorded: 03/19/2008
Attorney Dkt #:2522-258
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12051619
Filing Dt:
03/19/2008
Publication #:
Pub Dt:
09/25/2008
Title:
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE
Assignors
1
Exec Dt:
02/10/2008
2
Exec Dt:
03/14/2008
3
Exec Dt:
03/10/2008
4
Exec Dt:
03/10/2008
5
Exec Dt:
03/10/2008
6
Exec Dt:
03/14/2008
7
Exec Dt:
03/10/2008
8
Exec Dt:
03/10/2008
Assignee
1
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Correspondence name and address
MARGER JOHNSON & MCCOLLOM, P.C.
210 SW MORRISON STREET, SUITE 400
PORTLAND, OR 97204

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