Patent Assignment Details
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| Reel/Frame: | 035791/0480 | |
| Pages: | 3 |
| | Recorded: | 06/04/2015 | | |
| Attorney Dkt #: | 1314/231A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14621240
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Filing Dt:
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02/12/2015
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Publication #:
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Pub Dt:
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09/10/2015
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Title:
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CHIP PACKAGE INCLUDING DIE PAD CAVITY
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Assignee
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| 9F., NO. 23, JILIN RD. |
| ZHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 320 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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