Patent Assignment Details
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| Reel/Frame: | 015042/0482 | |
| Pages: | 4 |
| | Recorded: | 08/12/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10850864
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Filing Dt:
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05/21/2004
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Publication #:
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Pub Dt:
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02/24/2005
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Title:
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NON-SOLDER MASK DEFINED (NSMD) TYPE WIRING SUBSTRATE FOR BALL GRID ARRAY (BGA) PACKAGE AND METHOD FOR MANUFACTURING SUCH A WIRING SUBSTRATE
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Assignee
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| 416 MAETAN-DONG, YEONGTONG-GU, |
| SUWON-CITY |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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HOSOON LEE
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1030 S. W. MORRISON STREET
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PORTLAND, OR 97205
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