Patent Assignment Details
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| Reel/Frame: | 019966/0483 | |
| Pages: | 2 |
| | Recorded: | 10/01/2007 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11159152
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Filing Dt:
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06/23/2005
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Publication #:
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Pub Dt:
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06/29/2006
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Title:
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Stack chip package
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Assignee
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| EQUITY TRUSE CHAMBERS |
| P.O. BOX 3269 |
| APIA, AMERICAN SAMOA |
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Correspondence name and address
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LIN CHI-YUAN
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8F., NO. 249-1, SEC. 3, JHONGSIAO E. RD.
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DA-AN DISTRICT, TAIPEL CITY 106
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TAIWAN (R.O.C.)
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