Patent Assignment Details
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| Reel/Frame: | 040211/0483 | |
| Pages: | 3 |
| | Recorded: | 11/03/2016 | | |
| Attorney Dkt #: | 3658H/176 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14931432
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Filing Dt:
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11/03/2015
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Publication #:
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Pub Dt:
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05/05/2016
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Title:
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Chip Substrate and Chip Package Module
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Assignee
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| 89, ASAN VALLEY-RO, DUNPO-MYEON |
| ASAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31409 |
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Correspondence name and address
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THOMAS J. TUYTSCHAEVERS
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SUNSTEIN KANN MURPHY & TIMBERS LLP
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125 SUMMER STREET
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BOSTON, MA 02110-1618
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05/30/2024 08:57 PM
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