Patent Assignment Details
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Reel/Frame: | 016304/0488 | |
| Pages: | 4 |
| | Recorded: | 02/25/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/15/2008
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Application #:
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11026488
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Filing Dt:
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12/30/2004
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Publication #:
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Pub Dt:
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07/06/2006
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Title:
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PACKAGING STRUCTURE WITH COPLANAR FILLING PASTE AND DICE AND WITH PATTERNED GLUE FOR WL-CSP
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Assignee
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NO. 65, GUANGFU N. RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY 303 TAIWAN, CHINA |
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Correspondence name and address
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KUSNER & JAFFE
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HIGHLAND PLACE - SUITE 310
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6151 WILSON MILLS ROAD
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HIGHLAND HEIGHTS, OH 44143
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