|
Total properties:
24
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18149331
|
Filing Dt:
|
01/03/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2023
| | | | |
|
Title:
|
CURRENT SENSE CIRCUIT HAVING A TEMPERATURE COMPENSATED RESPONSE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18149862
|
Filing Dt:
|
01/04/2023
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2023
| | | | |
|
Title:
|
MICROLENS STRUCTURES FOR SEMICONDUCTOR DEVICE WITH SINGLE-PHOTON AVALANCHE DIODE PIXELS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2024
|
Application #:
|
18153133
|
Filing Dt:
|
01/11/2023
|
|
Publication #:
|
|
Pub Dt:
|
06/01/2023
| | | | |
|
Title:
|
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18154303
|
Filing Dt:
|
01/13/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2023
| | | | |
|
Title:
|
STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18154722
|
Filing Dt:
|
01/13/2023
|
|
Publication #:
|
|
Pub Dt:
|
04/25/2024
| | | | |
|
Title:
|
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18162972
|
Filing Dt:
|
02/01/2023
|
|
Publication #:
|
|
Pub Dt:
|
02/22/2024
| | | | |
|
Title:
|
FAST DEVICE REINITIALIZATION ON DSI3 BUS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
06/04/2024
|
Application #:
|
18164734
|
Filing Dt:
|
02/06/2023
|
|
Publication #:
|
|
Pub Dt:
|
06/15/2023
| | | | |
|
Title:
|
JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18167998
|
Filing Dt:
|
02/13/2023
|
|
Publication #:
|
|
Pub Dt:
|
02/08/2024
| | | | |
|
Title:
|
JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18169780
|
Filing Dt:
|
02/15/2023
|
|
Publication #:
|
|
Pub Dt:
|
06/22/2023
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18171029
|
Filing Dt:
|
02/17/2023
|
|
Publication #:
|
|
Pub Dt:
|
11/02/2023
| | | | |
|
Title:
|
VERTICAL SHIELDED GATE ACCUMULATION FIELD EFFECT TRANSISTOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18172641
|
Filing Dt:
|
02/22/2023
|
|
Publication #:
|
|
Pub Dt:
|
06/29/2023
| | | | |
|
Title:
|
SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18172730
|
Filing Dt:
|
02/22/2023
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2024
| | | | |
|
Title:
|
Image Sensor with a Bond Pad
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2024
|
Application #:
|
18174017
|
Filing Dt:
|
02/24/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2023
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND HYBRID ISOLATION STRUCTURES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18179903
|
Filing Dt:
|
03/07/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2023
| | | | |
|
Title:
|
MULTIPHASE POWER CONVERTER WITH CLC RESONANT CIRCUIT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18182140
|
Filing Dt:
|
03/10/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2023
| | | | |
|
Title:
|
POWER DEVICE WITH GRADED CHANNEL
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/28/2024
|
Application #:
|
18182186
|
Filing Dt:
|
03/10/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2023
| | | | |
|
Title:
|
TRANSISTOR DEVICE HAVING A SOURCE REGION SEGMENTS AND BODY REGION SEGMENTS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18182552
|
Filing Dt:
|
03/13/2023
|
|
Publication #:
|
|
Pub Dt:
|
04/11/2024
| | | | |
|
Title:
|
INTEGRATED SUBSTRATES AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18185548
|
Filing Dt:
|
03/17/2023
|
|
Publication #:
|
|
Pub Dt:
|
11/09/2023
| | | | |
|
Title:
|
EDGE SEALS FOR SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18186842
|
Filing Dt:
|
03/20/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2023
| | | | |
|
Title:
|
HEAT TRANSFER FOR POWER MODULES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18188233
|
Filing Dt:
|
03/22/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2023
| | | | |
|
Title:
|
INSULATED GATED FIELD EFFECT TRANSISTOR STRUCTURE HAVING SHIELDED SOURCE AND METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18188580
|
Filing Dt:
|
03/23/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2023
| | | | |
|
Title:
|
POWER ADAPTERS WITH MULTIPLE CHARGING PORTS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18190725
|
Filing Dt:
|
03/27/2023
|
|
Publication #:
|
|
Pub Dt:
|
10/12/2023
| | | | |
|
Title:
|
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18191594
|
Filing Dt:
|
03/28/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2023
| | | | |
|
Title:
|
IMAGE SENSOR AMPLIFIERS WITH REDUCED INTER-CIRCULATION CURRENTS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18193977
|
Filing Dt:
|
03/31/2023
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2023
| | | | |
|
Title:
|
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
|
|
