Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056975/0490 | |
| Pages: | 14 |
| | Recorded: | 07/26/2021 | | |
| Attorney Dkt #: | QUAL/194170US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17061737
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Filing Dt:
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10/02/2020
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Publication #:
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Pub Dt:
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04/07/2022
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Title:
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INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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PATTERSON + SHERIDAN, L.L.P. QUALCOMM
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24 GREENWAY PLAZA, SUITE 1600
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HOUSTON, 77046 UNITED STATES
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