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Total properties:
84
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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09764913
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Filing Dt:
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01/17/2001
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Title:
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METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
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Patent #:
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Issue Dt:
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12/14/2004
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Application #:
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09764919
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Filing Dt:
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01/17/2001
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Publication #:
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Pub Dt:
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06/26/2003
| | | | |
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Title:
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LOW INERTIA LATCHING MICROACTUATOR
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Patent #:
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Issue Dt:
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10/05/2004
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Application #:
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09765520
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Filing Dt:
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01/17/2001
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Publication #:
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Pub Dt:
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07/18/2002
| | | | |
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Title:
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OPTICAL SWITCH WITH LOW-INERTIA MICROMIRROR
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Patent #:
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Issue Dt:
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02/26/2002
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Application #:
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09825760
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Filing Dt:
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04/03/2001
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Title:
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Microelectromechanical switch with braking algorithm
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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09873076
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Filing Dt:
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05/31/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Title:
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WAFER LEVEL METHOD FOR PROBING MICROMECHANICAL DEVICES
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10866123
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Filing Dt:
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06/12/2004
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Publication #:
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Pub Dt:
|
01/06/2005
| | | | |
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Title:
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METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11136552
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Filing Dt:
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05/25/2005
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Publication #:
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Pub Dt:
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11/30/2006
| | | | |
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Title:
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Microfabricated cross flow filter and method of manufacture
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11151415
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Filing Dt:
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06/14/2005
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Publication #:
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Pub Dt:
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12/14/2006
| | | | |
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Title:
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Antistiction MEMS substrate and method of manufacture
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Patent #:
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05/01/2007
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Application #:
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11151442
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Filing Dt:
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06/14/2005
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Publication #:
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Pub Dt:
|
12/14/2006
| | | | |
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Title:
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MEMS TEETER-TOTTER APPARATUS WITH CURVED BEAM AND METHOD OF MANUFACTURE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11211622
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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03/01/2007
| | | | |
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Title:
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Wafer level hermetic bond using metal alloy
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11211623
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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10/11/2007
| | | | |
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Title:
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DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH HERMETIC SEAL AND METHOD OF MANUFACTURE
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Patent #:
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06/19/2007
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11211624
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Title:
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TRENCH PLATING PROCESS AND APPARATUS FOR THROUGH HOLE VIAS
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Patent #:
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09/01/2009
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11211625
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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03/01/2007
| | | | |
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Title:
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HERMETIC INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURE
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Patent #:
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10/02/2007
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Application #:
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11221745
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Filing Dt:
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09/09/2005
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Publication #:
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Pub Dt:
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03/15/2007
| | | | |
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Title:
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MULTIPLE SWITCH MEMS STRUCTURE AND METHOD OF MANUFACTURE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11263912
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Filing Dt:
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11/02/2005
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Publication #:
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05/03/2007
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Title:
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Compact MEMS thermal device and method of manufacture
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11/28/2006
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11272689
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11/15/2005
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03/23/2006
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Title:
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METHOD AND APPARATUS FOR ASSEMBLING AN ARRAY OF MICRO-DEVICES
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Patent #:
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08/04/2009
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11304601
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12/16/2005
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Pub Dt:
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03/01/2007
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Title:
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
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06/16/2009
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11334438
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01/19/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Title:
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HYSTERETIC MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
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Patent #:
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05/19/2009
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Application #:
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11347219
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02/06/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Title:
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ELASTIC INTERFACE FOR WAFER BONDING APPARATUS
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Patent #:
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08/31/2010
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11359558
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02/23/2006
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Publication #:
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Pub Dt:
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08/23/2007
| | | | |
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Title:
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SYSTEM AND METHOD FOR FORMING MOVEABLE FEATURES ON A COMPOSITE SUBSTRATE
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Patent #:
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NONE
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Application #:
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11364334
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Filing Dt:
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03/01/2006
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Publication #:
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Pub Dt:
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09/06/2007
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Title:
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Method and apparatus for curing epoxy-based photoresist using a continuously varying temperature profile
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01/18/2011
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11378340
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03/20/2006
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Pub Dt:
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09/20/2007
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Title:
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MEMS THERMAL DEVICE WITH SLIDEABLY ENGAGED TETHER AND METHOD OF MANUFACTURE
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10/12/2010
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11386733
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03/23/2006
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Publication #:
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Pub Dt:
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09/27/2007
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Title:
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MEMS DEVICE USING NIMN ALLOY AND METHOD OF MANUFACTURE
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Patent #:
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10/05/2010
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11390085
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03/28/2006
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Pub Dt:
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10/11/2007
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Title:
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WAFER BONDING MATERIAL WITH EMBEDDED RIGID PARTICLES
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Patent #:
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12/09/2008
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11433435
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05/15/2006
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Pub Dt:
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11/15/2007
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Title:
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INDENTED STRUCTURE FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
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06/23/2009
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11434768
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05/17/2006
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Pub Dt:
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11/22/2007
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Title:
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SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
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NONE
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11482944
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07/10/2006
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01/10/2008
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Title:
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System and method for forming through wafer vias using reverse pulse plating
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05/25/2010
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11516489
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09/07/2006
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Pub Dt:
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03/13/2008
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Title:
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SINGLY ATTACHED MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
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03/09/2010
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11541774
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10/03/2006
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04/03/2008
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Title:
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INTERCONNECT STRUCTURE USING THROUGH WAFER VIAS AND METHOD OF FABRICATION
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03/30/2010
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11546288
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10/12/2006
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04/17/2008
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Title:
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CONTACT ELECTRODE FOR MICRODEVICES AND ETCH METHOD OF MANUFACTURE
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03/30/2010
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11605312
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11/29/2006
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05/29/2008
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Title:
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CURRENT-DRIVEN DEVICE USING NIMN ALLOY AND METHOD OF MANUFACTURE
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12/01/2009
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11705738
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02/14/2007
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07/19/2007
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Title:
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HYSTERETIC MEMS TWO-DIMENSIONAL THERMAL DEVICE AND METHOD OF MANUFACTURE
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11/24/2009
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11705739
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02/14/2007
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08/14/2008
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Title:
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MEMS THERMAL ACTUATOR AND METHOD OF MANUFACTURE
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NONE
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11785119
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04/16/2007
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10/16/2008
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Title:
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Micromechanical device with gold alloy contacts and method of manufacture
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06/28/2011
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11797659
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05/07/2007
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11/13/2008
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Title:
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LID STRUCTURE FOR MICRODEVICE AND METHOD OF MANUFACTURE
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02/22/2011
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11797924
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05/09/2007
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11/13/2008
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Title:
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DUAL SUBSTRATE MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
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NONE
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11819338
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06/27/2007
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01/01/2009
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Title:
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Gettering material for encapsulated microdevices and method of manufacture
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05/11/2010
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11826841
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07/19/2007
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01/22/2009
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Title:
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ETCHING/BONDING CHAMBER FOR ENCAPSULATED DEVICES AND METHOD OF USE
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07/05/2011
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11896648
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09/05/2007
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12/27/2007
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Title:
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WAFER BONDING MATERIAL WITH EMBEDDED CONDUCTIVE PARTICLES
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NONE
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12007485
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01/11/2008
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05/31/2012
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Title:
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Deposition/bonding chamber for encapsulated microdevices and method of use
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01/04/2011
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12068586
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02/08/2008
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11/13/2008
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Title:
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MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
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NONE
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12149637
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05/06/2008
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06/28/2012
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Title:
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Removable/disposable apparatus for MEMS particle sorting device
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NONE
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12222845
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08/18/2008
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12/25/2008
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Title:
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Wafer level hermetic bond using metal alloy
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01/03/2012
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12232298
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09/15/2008
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01/19/2012
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Title:
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SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
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07/20/2010
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12285817
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10/15/2008
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02/26/2009
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Title:
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INDENTED LID FOR ENCAPSULATED DEVICES AND METHOD OF MANUFACTURE
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05/17/2011
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12318634
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01/05/2009
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08/13/2009
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Title:
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HYSTERETIC MEMS THERMAL DEVICE AND METHOD OF MANUFACTURE
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07/20/2010
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12382142
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03/10/2009
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07/16/2009
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Title:
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MEMS THERMAL ACTUATOR AND METHOD OF MANUFACTURE
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06/14/2011
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12459956
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07/11/2009
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01/07/2010
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08/21/2012
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10/02/2009
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01/28/2010
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09/24/2013
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12662237
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04/07/2010
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10/13/2011
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Inlaid optical material and method of manufacture
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04/08/2014
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12801162
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05/26/2010
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12/01/2011
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Title:
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IN-PLANE ELECTROMAGNETIC MEMS PUMP
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01/01/2013
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12923693
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10/05/2010
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04/05/2012
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PLATING PROCESS AND APPARATUS FOR THROUGH WAFER FEATURES
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10/16/2012
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12923872
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10/13/2010
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02/03/2011
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH KEEPER LAYER
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06/18/2013
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12929257
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01/11/2011
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06/02/2011
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Title:
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CONFIGURABLE POWER SUPPLY USING MEMS SWITCH
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09/11/2012
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12929259
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01/11/2011
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06/30/2011
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Title:
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DUAL SUBSTRATE MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
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12/17/2013
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13067325
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05/25/2011
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11/29/2012
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Title:
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Microfabricated electromagnetic actuator with push-pull motion
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10/15/2013
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13137883
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09/20/2011
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03/22/2012
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Title:
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INDUCTIVE GETTER ACTIVATION FOR HIGH VACUUM PACKAGING
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12/25/2012
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13373969
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12/07/2011
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10/28/2014
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01/23/2012
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07/26/2012
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Title:
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MEMS PARTICLE SORTING ACTUATOR AND METHOD OF MANUFACTURING
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09/02/2014
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01/23/2012
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07/26/2012
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Cartridge for MEMS particle sorting system
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NONE
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13385214
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02/08/2012
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08/08/2013
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03/31/2015
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05/23/2012
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10/11/2012
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05/27/2014
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08/30/2012
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12/20/2012
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH KEEPER LAYER
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09/30/2014
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13986467
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05/07/2013
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EXOTHERMIC ACTIVATION FOR HIGH VACUUM PACKAGING
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03/01/2016
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13987463
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07/29/2013
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01/29/2015
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Microfabricated magnetic field transducer with flux guide
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06/21/2016
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07/29/2013
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01/29/2015
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MEMS PARTICLE SORTING ACTUATOR AND METHOD OF MANUFACTURE
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NONE
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13987871
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09/11/2013
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03/12/2015
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Method for forming through wafer vias
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04/19/2016
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14142712
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12/27/2013
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07/02/2015
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METHOD USING GLASS SUBSTRATE ANODIC BONDING
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10/20/2015
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14194794
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03/02/2014
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09/24/2015
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE AND WETTING LAYER
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10/13/2015
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14326406
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07/08/2014
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METHOD AND DEVICE USING SILICON SUBSTRATE TO GLASS SUBSTRATE ANODIC BONDING
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05/03/2016
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14456972
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08/11/2014
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02/11/2016
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SOLDER BUMP SEALING METHOD AND DEVICE
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04/26/2016
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14619068
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02/11/2015
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03/31/2016
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Title:
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METHOD FOR FORMING THROUGH SUBSTRATE VIAS WITH TETHERS
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04/05/2016
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14738980
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06/15/2015
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METHOD FOR FORMING A MICROFABRICATED STRUCTURE
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03/28/2017
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11/04/2015
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05/05/2016
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MICROFABRICATED OPTICAL APPARATUS
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04/24/2018
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15060630
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03/04/2016
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09/15/2016
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DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH MULTIPLE HINGES AND METHOD OF MANUFACTURE
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01/03/2017
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15098353
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04/14/2016
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10/20/2016
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Anodic Bonding of Dielectric Substrates
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11/15/2016
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15144735
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05/02/2016
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ETCHING TECHNIQUE FOR MICROFABRICATION SUBSTRATES
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NONE
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15149217
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05/09/2016
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11/24/2016
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THERMOCOMPRESSION BONDING WITH RAISED FEATURE
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NONE
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15232871
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08/10/2016
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03/02/2017
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DEVICE WITH SEPARATION LIMITING STANDOFF
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NONE
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15237120
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08/15/2016
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03/02/2017
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MEMS REED SWITCH DEVICE
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NONE
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15272481
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09/22/2016
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08/17/2017
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MICROFABRICATED OPTICAL APPARATUS
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NONE
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15355461
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11/18/2016
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05/25/2017
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MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACE
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NONE
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15408956
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01/18/2017
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05/04/2017
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MICROFABRICATED OPTICAL APPARATUS
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NONE
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15415919
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01/26/2017
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08/03/2017
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Title:
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THROUGH SUBSTRATE VIAS USING SOLDER BUMPS
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