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Patent Assignment Details
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Reel/Frame:014946/0494   Pages: 3
Recorded: 01/29/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/17/2006
Application #:
10767921
Filing Dt:
01/29/2004
Publication #:
Pub Dt:
08/04/2005
Title:
DIE-WAFER PACKAGE AND METHOD OF FABRICATING SAME
Assignor
1
Exec Dt:
01/26/2004
Assignee
1
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707-0006
Correspondence name and address
TRASKBRITT
BRADLEY B. JENSEN
P.O. BOX 2550
SALT LAKE CITY, UT 84110

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