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Patent Assignment Details

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Reel/Frame:	053717/0495			Pages:	9
		Recorded:	09/07/2020
Attorney Dkt #:	ATK-ATSH ASSIGNMENT
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	11282763	Issue Dt:	03/22/2022	Application #:	16450680	Filing Dt:	06/24/2019
Publication #:	US20200402885	Pub Dt:	12/24/2020
Title:	SEMICONDUCTOR DEVICE HAVING A LID WITH THROUGH-HOLES

Patent #:	11145638	Issue Dt:	10/12/2021	Application #:	16571904	Filing Dt:	09/16/2019
Publication #:	US20210082891	Pub Dt:	03/18/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11101540	Issue Dt:	08/24/2021	Application #:	16590801	Filing Dt:	10/02/2019
Publication #:	US20210104809	Pub Dt:	04/08/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11257976	Issue Dt:	02/22/2022	Application #:	16596566	Filing Dt:	10/08/2019
Publication #:	US20210104642	Pub Dt:	04/08/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11127647	Issue Dt:	09/21/2021	Application #:	16702854	Filing Dt:	12/04/2019
Publication #:	US20210175140	Pub Dt:	06/10/2021
Title:	SEMICONDUCTOR DEVICES AND RELATED METHODS

Patent #:	11158582	Issue Dt:	10/26/2021	Application #:	16703240	Filing Dt:	12/04/2019
Publication #:	US20210175177	Pub Dt:	06/10/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11437526	Issue Dt:	09/06/2022	Application #:	16707114	Filing Dt:	12/09/2019
Publication #:	US20210175372	Pub Dt:	06/10/2021
Title:	ELECTRONIC DEVICES HAVING A SENSOR AND A TRANSLUCENT MOLD COMPOUND AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Patent #:	11694906	Issue Dt:	07/04/2023	Application #:	16748956	Filing Dt:	01/22/2020
Publication #:	US20210066093	Pub Dt:	03/04/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11342268	Issue Dt:	05/24/2022	Application #:	16775648	Filing Dt:	01/29/2020
Publication #:	US20210233848	Pub Dt:	07/29/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11908755	Issue Dt:	02/20/2024	Application #:	16797307	Filing Dt:	02/21/2020
Publication #:	US20210265225	Pub Dt:	08/26/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11749637	Issue Dt:	09/05/2023	Application #:	16908928	Filing Dt:	06/23/2020
Publication #:	US20210398940	Pub Dt:	12/23/2021
Title:	HYBRID BONDING INTERCONNECTION USING LASER AND THERMAL COMPRESSION

Patent #:	11574890	Issue Dt:	02/07/2023	Application #:	16918074	Filing Dt:	07/01/2020
Publication #:	US20220005787	Pub Dt:	01/06/2022
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11355451	Issue Dt:	06/07/2022	Application #:	17002607	Filing Dt:	08/25/2020
Publication #:	US20210066206	Pub Dt:	03/04/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11562936	Issue Dt:	01/24/2023	Application #:	17008239	Filing Dt:	08/31/2020
Publication #:	US20220068739	Pub Dt:	03/03/2022
Title:	ELECTRIONIC DEVICES WITH INTERPOSER AND REDISTRIBUTION LAYER

Assignor

Exec Dt:

12/17/2019

Assignee

491B RIVER VALLEY ROAD

VALLEY POINT #12-03

SINGAPORE, SINGAPORE 248373

Correspondence name and address
	SPECTRUM IP LAW GROUP LLC
	558 CASTLE PINES PARKWAY
	B4-362
	CASTLE PINES, CO 80108

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