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Patent Assignment Details
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Reel/Frame:014943/0496   Pages: 4
Recorded: 02/05/2004
Conveyance: CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
02/18/2003
Application #:
09496820
Filing Dt:
02/02/2000
Title:
VACUUM PACKAGE FABRICATION OF INTEGRATED CIRCUIT COMPONENTS
2
Patent #:
Issue Dt:
11/12/2002
Application #:
09496826
Filing Dt:
02/02/2000
Title:
VACUUM PACKAGE FABRICATION OF MICROELECTROMECHANICAL SYSTEM DEVICES WITN INTEGRATED CIRCUIT COMPONENTS
3
Patent #:
Issue Dt:
07/01/2003
Application #:
09928031
Filing Dt:
08/10/2001
Publication #:
Pub Dt:
01/03/2002
Title:
VACUUM PACKAGE FABRICATION OF INTEGRATED CIRCUIT COMPONENTS
Assignor
1
Exec Dt:
01/27/2004
Assignee
1
26 ELECTRONIC PARKWAY
AFRL/IFOJ
ROME, NEW YORK 13441-4514
Correspondence name and address
JUDITH M. DECKER
AFRL/IFOJ
26 ELECTRONIC PARKWAY
ROME, NY 13441-4514

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