Patent Assignment Details
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| Reel/Frame: | 011779/0499 | |
| Pages: | 3 |
| | Recorded: | 05/02/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09847088
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Filing Dt:
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05/02/2001
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Publication #:
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Pub Dt:
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11/07/2002
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Title:
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Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD, 2 |
| HSIN-CHU CITY, TAIWAN R.O.C |
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Correspondence name and address
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POWELL, GOLDSTEIN, FRAZER & MURPHY LLP
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THOMAS T. MOGA
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P.O. BOX 97223
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WASHINGTON, D.C. 20090-7223
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