Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065464/0500 | |
| Pages: | 4 |
| | Recorded: | 11/06/2023 | | |
| Attorney Dkt #: | 27667US16 / US10 / US04 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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12387691
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Filing Dt:
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05/05/2009
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Title:
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BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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06/27/2017
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Application #:
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13679627
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Filing Dt:
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11/16/2012
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Title:
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BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16665499
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Filing Dt:
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10/28/2019
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Publication #:
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Pub Dt:
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02/27/2020
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Title:
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METHODS OF MANUFACTURING AN ENCAPSULATED SEMICONDUCTOR DEVICE
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 W. MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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