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Patent Assignment Details

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Reel/Frame:	034292/0501			Pages:	6
		Recorded:	12/01/2014
Attorney Dkt #:	GLOBAL LED SOLUTIONS-ID
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	6242800	Issue Dt:	06/05/2001	Application #:	08815814	Filing Dt:	03/12/1997
Title:	HEAT DISSIPATING DEVICE PACKAGE

Patent #:	5814884	Issue Dt:	09/29/1998	Application #:	08816829	Filing Dt:	03/18/1997
Title:	COMMONLY HOUSED DIVERSE SEMICONDUCTOR DIE

Patent #:	6144093	Issue Dt:	11/07/2000	Application #:	09070097	Filing Dt:	04/27/1998
Title:	COMMONLY HOUSED DIVERSE SEMICONDUCTOR DIE WITH REDUCED INDUCTANCE

Patent #:	6133632	Issue Dt:	10/17/2000	Application #:	09161790	Filing Dt:	09/28/1998
Title:	COMMONLY HOUSED DIVERSE SEMICONDUCTOR DEVICE

Patent #:	6184585	Issue Dt:	02/06/2001	Application #:	09191951	Filing Dt:	11/13/1998
Title:	CO-PACKAGED MOS-GATED DEVICE AND CONTROL INTEGRATED CIRCUIT

Patent #:	6281096	Issue Dt:	08/28/2001	Application #:	09556213	Filing Dt:	04/21/2000
Title:	CHIP SCALE PACKAGING METHOD

Patent #:	6291262	Issue Dt:	09/18/2001	Application #:	09563358	Filing Dt:	05/03/2000
Title:	Surface mount to-220 package and process for the manufacture thereof

Patent #:	6297552	Issue Dt:	10/02/2001	Application #:	09645060	Filing Dt:	08/24/2000
Title:	Commonly housed diverse semiconductor die

Patent #:	6621166	Issue Dt:	09/16/2003	Application #:	09860304	Filing Dt:	05/18/2001
Publication #:	US20010042592	Pub Dt:	11/22/2001
Title:	FIVE LAYER ADHESIVE/INSULATOR/METAL/INSULATOR/ADHESIVE TAPE FOR SEMICONDUCTOR DIE PACKAGING

Patent #:	6404050	Issue Dt:	06/11/2002	Application #:	09966092	Filing Dt:	10/01/2001
Publication #:	US20020008319	Pub Dt:	01/24/2002
Title:	COMMONLY HOUSED DIVERSE SEMICONDUCTOR

Patent #:	6765292	Issue Dt:	07/20/2004	Application #:	10316249	Filing Dt:	12/10/2002
Publication #:	US20030107130	Pub Dt:	06/12/2003
Title:	CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Patent #:	6768211	Issue Dt:	07/27/2004	Application #:	10633752	Filing Dt:	08/04/2003
Publication #:	US20040026795	Pub Dt:	02/12/2004
Title:	FIVE LAYER ADHESIVE/INSULATOR/METAL/INSULATOR/ADHESIVE TAPE FOR SEMICONDUCTOR DIE PACKAGING

Patent #:	7167043	Issue Dt:	01/23/2007	Application #:	10993951	Filing Dt:	11/19/2004
Publication #:	US20050111157	Pub Dt:	05/26/2005
Title:	DECOUPLING CIRCUIT FOR CO-PACKAGED SEMICONDUCTOR DEVICES

Assignor

Exec Dt:

11/26/2014

Assignee

10TH FLOOR, GOLDEN TOWER

511, SAMSUNG-RO, GANGNAM-GU

SEOUL, KOREA, REPUBLIC OF 135-090

Correspondence name and address
	HC PARK & ASSOCIATES, PLC
	1894 PRESTON WHITE DR.
	RESTON, VA 20191

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