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Reel/Frame:024786/0502   Pages: 3
Recorded: 08/04/2010
Attorney Dkt #:80159/40436
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/01/2013
Application #:
12849692
Filing Dt:
08/03/2010
Publication #:
Pub Dt:
11/25/2010
Title:
METHOD FOR FORMING VIAS IN A SEMICONDUCTOR SUBSTRATE AND A SEMICONDUCTOR DEVICE HAVING THE SEMICONDUCTOR SUBSTRATE
Assignor
1
Exec Dt:
07/27/2010
Assignee
1
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondence name and address
MCCRACKEN & FRANK LLP
311 S. WACKER DRIVE
SUITE 2500
CHICAGO, IL 60606

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