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Patent Assignment Details
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Reel/Frame:061503/0510   Pages: 4
Recorded: 10/21/2022
Attorney Dkt #:04017.0265U2 (A 5661 US)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/11/2023
Application #:
17457681
Filing Dt:
12/06/2021
Publication #:
Pub Dt:
03/24/2022
Title:
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
Assignor
1
Exec Dt:
03/19/2020
Assignee
1
NO. 5000 JIN DU ROAD
SHANGHAI, CHINA 201108
Correspondence name and address
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTMENT
1600 PARKWOOD CIRCLE SE, SUITE 620
ATLANTA, GA 30339

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