Patent Assignment Details
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| Reel/Frame: | 037299/0514 | |
| Pages: | 3 |
| | Recorded: | 12/16/2015 | | |
| Attorney Dkt #: | DNCP0011USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14970552
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Filing Dt:
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12/16/2015
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Publication #:
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Pub Dt:
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06/22/2017
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Title:
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BUMP STRUCTURE HAVING FIRST PORTION OF COPPER AND SECOND PORTION OF PURE TIN COVERING THE FIRST PORTION, AND INTERCONNECT STRUCTURE USING THE SAME
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Assignee
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| 9F, NO. 233-2, PAO-CHIAO ROAD. HSIN-TIEN DISTRICT |
| NEW TAIPEI CITY, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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