Patent Assignment Details
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| Reel/Frame: | 008168/0515 | |
| Pages: | 4 |
| | Recorded: | 08/27/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/05/1998
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Application #:
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08697702
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Filing Dt:
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08/27/1996
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Title:
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HEAT SINK AND CIRCUIT ENCLOSURE FOR HIGH POWER ELECTRONIC CIRCUITS
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Assignee
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| B1, #15, LANE 174, HSIN MING RD., NEIHU |
| TAIPEI, TAIWAN R.O.C |
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Correspondence name and address
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GEORGE O. SALLE
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20 MCINTOSH DRIVE
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POUGHKEEPSIE, NEW YORK 12603
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