Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052294/0515 | |
| Pages: | 4 |
| | Recorded: | 04/02/2020 | | |
| Attorney Dkt #: | 21XD-210268-US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2022
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Application #:
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16587705
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Filing Dt:
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09/30/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Title:
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HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELECTRONICS APPLICATIONS
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Assignee
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| 34 ROBINSON ROAD |
| CLINTON, NEW YORK 20876 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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650 TOWN CENTER DRIVE, 4TH FLOOR
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COSTA MESA, CA 92626
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06/03/2024 09:21 PM
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