Patent Assignment Details
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| Reel/Frame: | 011428/0516 | |
| Pages: | 2 |
| | Recorded: | 12/28/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09752904
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Filing Dt:
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12/28/2000
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Publication #:
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Pub Dt:
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07/04/2002
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Title:
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SEMICONDUCTOR DIE PACKAGE AND SYSTEM
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Assignee
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| P.O. BOX 655474, M/S 3999 |
| DALLAS, TEXAS 75265 |
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Correspondence name and address
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TEXAS INSTRUMENTS, INC.
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J. DENNIS MOORE
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P.O. BOX 655474, M/S 3999
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DALLAS, TX 75265
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