Patent Assignment Details
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| Reel/Frame: | 031129/0516 | |
| Pages: | 4 |
| | Recorded: | 09/03/2013 | | |
| Attorney Dkt #: | QCOM-2166US (130183) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/2016
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Application #:
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13969436
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Filing Dt:
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08/16/2013
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Publication #:
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Pub Dt:
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02/19/2015
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Title:
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CRACK STOPPING STRUCTURE IN WAFER LEVEL PACKAGING (WLP)
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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LOZA & LOZA, LLP/QUALCOMM
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305 N. SECOND AVE., #127
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UPLAND, CA 91786
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