Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066673/0517 | |
| Pages: | 15 |
| | Recorded: | 03/06/2024 | | |
| Attorney Dkt #: | 60068US02/03/04 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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07/24/2018
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Application #:
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15149141
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Filing Dt:
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05/08/2016
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Publication #:
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Pub Dt:
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01/19/2017
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16042798
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Filing Dt:
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07/23/2018
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Publication #:
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Pub Dt:
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12/06/2018
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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NONE
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Issue Dt:
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06/11/2024
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Application #:
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17501857
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Filing Dt:
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10/14/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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PHILIP HENRY SHERIDAN
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500 W. MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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05/31/2024 04:27 PM
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