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Reel/Frame:045583/0519   Pages: 5
Recorded: 03/13/2018
Attorney Dkt #:GFSP2016NAT30US0
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/13/2018
Application #:
15434076
Filing Dt:
02/16/2017
Publication #:
Pub Dt:
08/16/2018
Title:
SEAL RING FOR WAFER LEVEL PACKAGE
Assignors
1
Exec Dt:
09/18/2017
2
Exec Dt:
09/07/2017
3
Exec Dt:
10/10/2017
Assignee
1
60 WOODLANDS INDUSTRIAL PARK D STREET 2
SINGAPORE, SINGAPORE 738406
Correspondence name and address
HORIZON IP PTE. LTD.
7500A BEACH ROAD, #04-306/308
THE PLAZA
SINGAPORE, 199591 SINGAPORE

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