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Patent Assignment Details

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Reel/Frame:	015942/0521			Pages:	22
		Recorded:	11/02/2004
Conveyance:	SECURITY AGREEMENT

Total properties: 338
Page 4 of 4
Pages: 1 2 3 4

Patent #:	6396130	Issue Dt:	05/28/2002	Application #:	09953422	Filing Dt:	09/14/2001
Title:	SEMICONDUCTOR PACKAGE HAVING MULTIPLE DIES WITH INDEPENDENTLY BIASED BACK SURFACES

Patent #:	6555917	Issue Dt:	04/29/2003	Application #:	09974541	Filing Dt:	10/09/2001
Title:	SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MAKING THE SAME

Patent #:	6611047	Issue Dt:	08/26/2003	Application #:	09976866	Filing Dt:	10/12/2001
Publication #:	US20030073265	Pub Dt:	04/17/2003
Title:	SEMICONDUCTOR PACKAGE WITH SINGULATION CREASE

Patent #:	6608497	Issue Dt:	08/19/2003	Application #:	09978535	Filing Dt:	10/15/2001
Title:	APPARATUS AND METHOD FOR ALLOWING TESTING OF SEMICONDUCTOR DEVICES AT DIFFERENT TEMPERATURES

Patent #:	6686651	Issue Dt:	02/03/2004	Application #:	09996226	Filing Dt:	11/27/2001
Title:	MULTI-LAYER LEAD FRAME STRUCTURE

Patent #:	6605865	Issue Dt:	08/12/2003	Application #:	09998844	Filing Dt:	10/19/2001
Publication #:	US20020130400	Pub Dt:	09/19/2002
Title:	SEMICONDUCTOR PACKAGE WITH OPTIMIZED LEADFRAME BONDING STRENGTH

Patent #:	6507102	Issue Dt:	01/14/2003	Application #:	10006642	Filing Dt:	12/05/2001
Publication #:	US20020043402	Pub Dt:	04/18/2002
Title:	PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE

Patent #:	6684496	Issue Dt:	02/03/2004	Application #:	10007337	Filing Dt:	10/22/2001
Publication #:	US20020038714	Pub Dt:	04/04/2002
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	6630726	Issue Dt:	10/07/2003	Application #:	10008048	Filing Dt:	11/07/2001
Title:	POWER SEMICONDUCTOR PACKAGE WITH STRAP

Patent #:	6630661	Issue Dt:	10/07/2003	Application #:	10012378	Filing Dt:	12/12/2001
Title:	SENSOR MODULE WITH INTEGRATED DISCRETE COMPONENTS

Patent #:	6713322	Issue Dt:	03/30/2004	Application #:	10013160	Filing Dt:	12/10/2001
Publication #:	US20020140061	Pub Dt:	10/03/2002
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patent #:	6737750	Issue Dt:	05/18/2004	Application #:	10013396	Filing Dt:	12/07/2001
Title:	STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES

Patent #:	6740950	Issue Dt:	05/25/2004	Application #:	10046995	Filing Dt:	01/14/2002
Publication #:	US20020093078	Pub Dt:	07/18/2002
Title:	OPTICAL DEVICE PACKAGES HAVING IMPROVED CONDUCTOR EFFICIENCY, OPTICAL COUPLING AND THERMAL TRANSFER

Patent #:	6798046	Issue Dt:	09/28/2004	Application #:	10054124	Filing Dt:	01/22/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING RINGS STRUCTURE CONNECTED TO LEADS WITH VERTICALLY DOWNSET INNER ENDS

Patent #:	6784534	Issue Dt:	08/31/2004	Application #:	10067068	Filing Dt:	02/06/2002
Title:	THIN INTEGRATED CIRCUIT PACKAGE HAVING AN OPTICALLY TRANSPARENT WINDOW

Patent #:	6670698	Issue Dt:	12/30/2003	Application #:	10068717	Filing Dt:	02/05/2002
Title:	INTEGRATED CIRCUIT PACKAGE MOUNTING

Patent #:	6710438	Issue Dt:	03/23/2004	Application #:	10078718	Filing Dt:	02/19/2002
Publication #:	US20030155641	Pub Dt:	08/21/2003
Title:	ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES

Patent #:	6576998	Issue Dt:	06/10/2003	Application #:	10086293	Filing Dt:	02/28/2002
Title:	THIN SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIP AND ELECTRONIC DISCRETE DEVICE

Patent #:	6509637	Issue Dt:	01/21/2003	Application #:	10094731	Filing Dt:	03/08/2002
Title:	LOW PROFILE MOUNTING OF THICK INTEGRATED CIRCUIT PACKAGES WITHIN LOW-PROFILE CIRCUIT MODULES

Patent #:	6700187	Issue Dt:	03/02/2004	Application #:	10103048	Filing Dt:	03/21/2002
Publication #:	US20020140065	Pub Dt:	10/03/2002
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6770961	Issue Dt:	08/03/2004	Application #:	10115218	Filing Dt:	04/02/2002
Publication #:	US20020149092	Pub Dt:	10/17/2002
Title:	CARRIER FRAME AND SEMICONDUCTOR PACKAGE INCLUDING CARRIER FRAME

Patent #:	6683795	Issue Dt:	01/27/2004	Application #:	10121215	Filing Dt:	04/10/2002
Title:	SHIELD CAP AND SEMICONDUCTOR PACKAGE INCLUDING SHIELD CAP

Patent #:	6608366	Issue Dt:	08/19/2003	Application #:	10122598	Filing Dt:	04/15/2002
Title:	LEAD FRAME WITH PLATED END LEADS AND RECESSES

Patent #:	6627977	Issue Dt:	09/30/2003	Application #:	10142222	Filing Dt:	05/09/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING ISOLATED RING STRUCTURE

Patent #:	6710945	Issue Dt:	03/23/2004	Application #:	10161963	Filing Dt:	06/03/2002
Title:	INJECTION MOLDED LENS-BARREL ASSEMBLY AND METHOD FOR FABRICATING LENS-BARREL AND MOUNT ASSEMBLIES

Patent #:	6630728	Issue Dt:	10/07/2003	Application #:	10171702	Filing Dt:	06/14/2002
Publication #:	US20020148630	Pub Dt:	10/17/2002
Title:	PLASTIC INTEGRATED CIRCUIT PACKAGE AND LEADFRAME FOR MAKING THE PACKAGE

Patent #:	6747352	Issue Dt:	06/08/2004	Application #:	10223749	Filing Dt:	08/19/2002
Title:	INTEGRATED CIRCUIT HAVING MULTIPLE POWER/GROUND CONNECTIONS TO A SINGLE EXTERNAL TERMINAL AND METHOD THEREFOR

Patent #:	6650019	Issue Dt:	11/18/2003	Application #:	10224864	Filing Dt:	08/20/2002
Publication #:	US20020195624	Pub Dt:	12/26/2002
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES

Patent #:	6646290	Issue Dt:	11/11/2003	Application #:	10227054	Filing Dt:	08/23/2002
Title:	OPTIC SEMICONDUCTOR PACKAGE

Patent #:	6717822	Issue Dt:	04/06/2004	Application #:	10251410	Filing Dt:	09/20/2002
Title:	LEAD-FRAME METHOD AND CIRCUIT MODULE ASSEMBLY INCLUDING EDGE STIFFENER

Patent #:	6707138	Issue Dt:	03/16/2004	Application #:	10256905	Filing Dt:	09/26/2002
Publication #:	US20030075785	Pub Dt:	04/24/2003
Title:	SEMICONDUCTOR DEVICE INCLUDING METAL STRAP ELECTRICALLY COUPLED BETWEEN SEMICONDUCTOR DIE AND METAL LEADFRAME

Patent #:	6791076	Issue Dt:	09/14/2004	Application #:	10286589	Filing Dt:	10/31/2002
Publication #:	US20030057359	Pub Dt:	03/27/2003
Title:	IMAGE SENSOR PACKAGE

Patent #:	6717248	Issue Dt:	04/06/2004	Application #:	10306627	Filing Dt:	11/26/2002
Publication #:	US20030100142	Pub Dt:	05/29/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6798047	Issue Dt:	09/28/2004	Application #:	10329620	Filing Dt:	12/26/2002
Title:	PRE-MOLDED LEADFRAME

Patent #:	6777789	Issue Dt:	08/17/2004	Application #:	10340256	Filing Dt:	01/10/2003
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6723582	Issue Dt:	04/20/2004	Application #:	10356046	Filing Dt:	01/31/2003
Publication #:	US20030113954	Pub Dt:	06/19/2003
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP

Patent #:	6750545	Issue Dt:	06/15/2004	Application #:	10376988	Filing Dt:	02/28/2003
Title:	SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING

Patent #:	6794740	Issue Dt:	09/21/2004	Application #:	10387801	Filing Dt:	03/13/2003
Title:	LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES

Assignors

AMKOR TECHNOLOGY, INC.

Exec Dt:

10/27/2004

GUARDIAN ASSETS, INC.

Exec Dt:

10/27/2004

Assignee

CITICORP NORTH AMERICA, INC. AS "AGENT"

390 GREENWICH STREET

1345 ENTERPRISE DRIVE

NEW YORK, NEW YORK 10013

Correspondence name and address
	TERESA HARINGS
	WEIL, GOTSHAL & MANGES LLP
	767 5TH AVENUE
	NEW YORK, NY 10153

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