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Reel/Frame:023275/0523   Pages: 8
Recorded: 09/23/2009
Attorney Dkt #:100139.407USPC
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12373881
Filing Dt:
09/23/2009
Publication #:
Pub Dt:
03/04/2010
Title:
METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UNIT USED THEREIN
Assignors
1
Exec Dt:
03/23/2009
2
Exec Dt:
04/11/2009
3
Exec Dt:
06/16/2009
4
Exec Dt:
03/25/2009
5
Exec Dt:
03/23/2009
6
Exec Dt:
03/23/2009
Assignee
1
1 FUSIONOPOLIS WAY, #20-10
CONNEXIS
SINGAPORE, SINGAPORE 138632
Correspondence name and address
WILLIAM T. CHRISTIANSEN, PH.D.
SEED IP LAW GROUP PLLC
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104

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