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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:037482/0523   Pages: 11
Recorded: 01/13/2016
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 26
1
Patent #:
6557978
Issue Dt:
05/06/2003
Application #:
10040455
Filing Dt:
01/09/2002
Publication #:
US20020089569
Pub Dt:
07/11/2002
Title:
INKJET DEVICE ENCAPSULATED AT THE WAFER SCALE
2
Patent #:
6766998
Issue Dt:
07/27/2004
Application #:
10040456
Filing Dt:
01/09/2002
Publication #:
US20020090413
Pub Dt:
07/11/2002
Title:
MOLDS FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
3
Patent #:
6759723
Issue Dt:
07/06/2004
Application #:
10040473
Filing Dt:
01/09/2002
Publication #:
US20020088988
Pub Dt:
07/11/2002
Title:
LIGHT EMITTING SEMICONDUCTOR PACKAGE
4
Patent #:
6750083
Issue Dt:
06/15/2004
Application #:
10129499
Filing Dt:
05/06/2002
Publication #:
US20030092229
Pub Dt:
05/15/2003
Title:
USE OF PROTECTIVE CAPS AS MASKS AT A WAFER SCALE
5
Patent #:
6949217
Issue Dt:
09/27/2005
Application #:
10129500
Filing Dt:
05/06/2002
Publication #:
US20030090040
Pub Dt:
05/15/2003
Title:
USE OF INFRARED RADIATION IN MOLDING OF PROTECTIVE CAPS
6
Patent #:
7014451
Issue Dt:
03/21/2006
Application #:
10129504
Filing Dt:
05/06/2002
Publication #:
US20030091674
Pub Dt:
05/15/2003
Title:
MOLDING ASSEMBLY FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
7
Patent #:
6777259
Issue Dt:
08/17/2004
Application #:
10129505
Filing Dt:
05/06/2002
Publication #:
US20030122227
Pub Dt:
07/03/2003
Title:
ACCELEROMETER PROTECTED BY CAPS APPLIED AT THE WAFER SCALE
8
Patent #:
6923524
Issue Dt:
08/02/2005
Application #:
10250967
Filing Dt:
07/10/2003
Publication #:
US20040080566
Pub Dt:
04/29/2004
Title:
INKJET DEVICE ENCAPSULATED AT THE WAFER SCALE
9
Patent #:
6967354
Issue Dt:
11/22/2005
Application #:
10466059
Filing Dt:
07/10/2003
Publication #:
US20040099868
Pub Dt:
05/27/2004
Title:
LIGHT EMITTING SEMICONDUCTOR PACKAGE
10
Patent #:
6870259
Issue Dt:
03/22/2005
Application #:
10466060
Filing Dt:
07/10/2003
Publication #:
US20040077139
Pub Dt:
04/22/2004
Title:
WAFER SCALE FIBER OPTIC TERMINATION
11
Patent #:
6991207
Issue Dt:
01/31/2006
Application #:
10466072
Filing Dt:
07/10/2003
Publication #:
US20040052886
Pub Dt:
03/18/2004
Title:
MOLDS FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
12
Patent #:
6979599
Issue Dt:
12/27/2005
Application #:
10728798
Filing Dt:
12/08/2003
Publication #:
US20040082104
Pub Dt:
04/29/2004
Title:
CHIP WITH MOLDED CAP ARRAY
13
Patent #:
6812062
Issue Dt:
11/02/2004
Application #:
10728799
Filing Dt:
12/08/2003
Publication #:
US20040082110
Pub Dt:
04/29/2004
Title:
MOLDED WAFER SCALE CAP
14
Patent #:
6977189
Issue Dt:
12/20/2005
Application #:
10728800
Filing Dt:
12/08/2003
Publication #:
US20040082105
Pub Dt:
04/29/2004
Title:
WAFER SCALE CAPS LOCATED BY MOLDING
15
Patent #:
7126216
Issue Dt:
10/24/2006
Application #:
10728808
Filing Dt:
12/08/2003
Publication #:
US20040079862
Pub Dt:
04/29/2004
Title:
TWO PART MOLD FOR WAFER SCALE CAPS
16
Patent #:
7026176
Issue Dt:
04/11/2006
Application #:
10728923
Filing Dt:
12/08/2003
Publication #:
US20040082115
Pub Dt:
04/29/2004
Title:
MOLD MAKING METHOD FOR WAFER SCALE CAPS
17
Patent #:
6989292
Issue Dt:
01/24/2006
Application #:
10728929
Filing Dt:
12/08/2003
Publication #:
US20040101992
Pub Dt:
05/27/2004
Title:
CHIPS WITH WAFER SCALE CAPS FORMED BY MOLDING
18
Patent #:
6982189
Issue Dt:
01/03/2006
Application #:
10728930
Filing Dt:
12/08/2003
Publication #:
US20040082119
Pub Dt:
04/29/2004
Title:
MOLDED WAFER SCALE CAP ARRAY
19
Patent #:
7001793
Issue Dt:
02/21/2006
Application #:
10791840
Filing Dt:
03/04/2004
Publication #:
US20040171186
Pub Dt:
09/02/2004
Title:
METHOD OF PROTECTING MICROFABRICATED DEVICES WITH PROTECTIVE CAPS
20
Patent #:
6878564
Issue Dt:
04/12/2005
Application #:
10853175
Filing Dt:
05/26/2004
Publication #:
US20040219700
Pub Dt:
11/04/2004
Title:
METHOD OF MANUFACTURING A LIGHT EMITTING SEMICONDUCTOR PACKAGE
21
Patent #:
6925875
Issue Dt:
08/09/2005
Application #:
10893376
Filing Dt:
07/19/2004
Publication #:
US20040255670
Pub Dt:
12/23/2004
Title:
PACKAGED ACCELEROMETER
22
Patent #:
7618575
Issue Dt:
11/17/2009
Application #:
10898214
Filing Dt:
07/26/2004
Publication #:
US20040262812
Pub Dt:
12/30/2004
Title:
METHOD FOR WAFER SCALE MOLDING OF PROTECTIVE CAPS
23
Patent #:
7008819
Issue Dt:
03/07/2006
Application #:
10949350
Filing Dt:
09/27/2004
Publication #:
US20050042802
Pub Dt:
02/24/2005
Title:
METHOD OF FABRICATING AN ARRAY OF WAFER SCALE POLYMERIC CAPS
24
Patent #:
7095109
Issue Dt:
08/22/2006
Application #:
10986362
Filing Dt:
11/12/2004
Publication #:
US20050094944
Pub Dt:
05/05/2005
Title:
OPTICAL FIBER TERMINATOR PACKAGE
25
Patent #:
7407614
Issue Dt:
08/05/2008
Application #:
11064005
Filing Dt:
02/24/2005
Publication #:
US20050142686
Pub Dt:
06/30/2005
Title:
METHOD FOR FORMING AT LEAST ONE PROTECTIVE CAP
26
Patent #:
7284976
Issue Dt:
10/23/2007
Application #:
11064006
Filing Dt:
02/24/2005
Publication #:
US20050142242
Pub Dt:
06/30/2005
Title:
MOULDING ASSEMBLY FOR FORMING AT LEAST ONE PROTECTIVE CAP
Assignor
1
KERWAR ACQUISITIONS LLC
Exec Dt:
08/26/2015
Assignee
1
NYTELL SOFTWARE LLC
2711 CENTERVILLE ROAD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondence name and address
MEYERTONS, HOOD, KIVLIN, KOWERT & GOETZE
1120 SOUTH CAPITAL OF TEXAS HIGHWAY
BUILDING 2, SUITE 300
AUSTIN, TX 78746

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