Patent Assignment Details
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| Reel/Frame: | 044322/0524 | |
| Pages: | 3 |
| | Recorded: | 12/06/2017 | | |
| Attorney Dkt #: | 21XD-264571 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/31/2020
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Application #:
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15833982
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Filing Dt:
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12/06/2017
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Publication #:
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Pub Dt:
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06/06/2019
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Title:
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SEMICONDUCTOR DEVICE ASSEMBLY INCLUDING A THERMAL INTERFACE BOND BETWEEN A SEMICONDUCTOR DIE AND A PASSIVE HEAT EXCHANGER
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Assignee
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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12275 EL CAMINO REAL, SUITE 200
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SAN DIEGO, CA 92130
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