Patent Assignment Details
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| Reel/Frame: | 010652/0525 | |
| Pages: | 3 |
| | Recorded: | 02/25/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/16/2002
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Application #:
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09513483
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Filing Dt:
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02/25/2000
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Title:
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Multi-Layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
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Assignee
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| 3256 WEST 25TH STREET |
| CLEVELAND, OHIO 44109 |
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Correspondence name and address
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WYATT, GERBER, MELLER AND O'ROURKE
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EUGENE LIEBERSTEIN
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P.O. BOX 2198
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GRAND CENTRAL STATION
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NEW YORK, NY 10163
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