Patent Assignment Details
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| Reel/Frame: | 014207/0526 | |
| Pages: | 3 |
| | Recorded: | 12/18/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10632551
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/08/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES AND HAVING ELECTRICAL SHIELD
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Assignee
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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HAYNES & BEFFEL LLP
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BILL KENNEDY
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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