Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016776/0534 | |
| Pages: | 10 |
| | Recorded: | 07/18/2005 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE THIRD INVENTOR TO YOUNGCHEOL KIM, PREVIOUSLY RECORDED ON REEL 015798 FRAME 0061. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11022375
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Filing Dt:
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12/23/2004
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Publication #:
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Pub Dt:
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01/19/2006
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE
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Assignee
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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BILL KENNEDY, HAYNES BEFFEL & WOLFELD
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HAYNES BEFFEL & WOLFELD
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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